XP692 No-Clean Leaded Solder Paste
XP692 provides features such as fine pitch capability (<16 mil), high-speed printing, and probable residues. In addition, XP692 solder paste exhibits excellent wettability, extraordinary print definition and tack life. The post soldering residues of XP692 are non-conductive, non-corrosive and highly insulated.

Request Sample | Request Quote | Tech. Data | Sds |