615D No-Clean Leaded Solder Paste
Designed for syringe dispensing applications, providing excellent wetting.igh tack force and good wetting. It meets J-STD-004/005 requirements and complies with Bellcore specifications. It is suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder

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