Delta Solder Paste is a unique blend of high quality solder powder with various paste flux formulations designed for use in Sn/Pb circuit board assembly.  Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies.  Delta Solder Paste types are available for printing, dispensing and package-on-package assembly.

DSP NO-CLEAN LEADED SOLDER PASTE
DSP 670I Leaded No-Clean Solder Paste
Stencil Printing: Alloys: Sn63/Pb37, Sn62/Pb36/Ag2, Sn10/Pb88/Ag2,
- REL1 Flux Classification
- Robust Sn/Pb Formulation
- Low Residue
- Non-conductive residues
670I No-Clean Leaded Solder Paste Description:
High tack formula for use in high speed component placement systems. Robust process window for leaded assembly. After reflow, a non-corrosive, non-conductive, highly insulated, transparent residue remains and is safe to leave on the boards. Bellcore compliant.

DSP XP692
Stencil Printing: Alloys: Sn63/Pb37, Sn62/Pb36/Ag2
- REL0
- Excellent Wettability
- Extended stencil time
- Soft, non-tacky residue

DSP 691A
Stencil Printing: Alloys: Sn63/Pb37
- REL0
- Pin Testable
- Low Residues
- Excellent wetting on OSP surfaces

DSP 800LF
Stencil Printing: Alloys: Sn100e
- ROL0
- Halogen Free
- Lower cost alloy compared to SAC
- Low Pin Testable residue


DSP 618D
Syringe Dispensing: Alloys: SAC Alloys, Sn100e
- ROL0
- Easily dispensed
- Hard, non-conductive residues
- Specifically for lead free applications

DSP WATER-SOLUBLE LEADED SOLDER PASTE
DSP 798LF
Stencil Printing: Alloys: Ecolloy, SAC Alloys, Sn96.5/Ag3.5, Sn95/Ag5, Sn42/Bi58,
- ORH1
- Enhanced activity for a broad range of applications
- Excellent printing characteristics
- Easy removal of residue

DSP 787LV
Stencil Printing: Alloys: SAC Alloys, Sn96.5/Ag3.5
- ORH1
- Low Voiding
- Fine pitch printing
- Enhanced fine pitch and stencil life

DSP 718D
Syringe Dispensing: Alloys: SAC Alloys, Sn96.5/Ag3.5, Sn100e, Sn42/Bi58
- ORH1
- Easily dispensed
- Yields bright, shiny joints
- Designed specifically for lead-free applications

DSP 718LF
Stencil Printing: Alloys: Sn100e
- ORH1
- Excellent wettability
- Lower cost alloy compared to SAC alloys
- Residues easily removed

DSP RMA & RA LEADED SOLDER PASTE
DSP 230 RMA
Stencil Printing: Alloys: SAC Alloys
- ROM0
- Designed For Fine Pitch Printing
- Yields bright shiny joints

DSP 215 RMA
Syringe Dispensing Printing: Alloys: SAC Alloys
- ROM0
- Easily dispensed
- Hard, non-conductive residues

DSP 315D RMA
Syringe Dispensing Printing: Alloys: SAC Alloys
- ROM0
- Superior wettability
- Hard, non-conductive residues
- Available for leaded and lead free solder paste

Particle Size Chart for Delta Solder Paste

Delta Solder Paste Packaging Options