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Lead Free No-Clean Solder Paste Comparison Chart |
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| Formulations | ||||||
| Flux Classification |
ROL1 |
ROL0 |
ROL0 |
ROL0 |
ROL0 |
ROL0 |
| Copper Mirror |
No-Removal |
No-Removal |
No-Removal |
No-Removal |
No-Removal |
No-Removal |
| Silver Chromate |
Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
| Corrosion | Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
| SIR JSTD-004 | Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
| Bellcore (Telecordia) | Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
| Electromigration | Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
| Metal Loading | 89% |
88% |
88.5% |
88% |
88.5% |
86% |
| Solder Ball Test | Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
| Stencil Life | >8 hrs |
>8 hrs |
>8 hrs |
>8 hrs |
>8 hrs |
>8 hrs |
| Abandon Time | 30-60 min. |
30-60 min. |
60 min. |
30-60 min. |
60 min. |
Dispensing |
| Application | Stencil Printing |
Stencil Printing |
Stencil Printing |
Stencil Printing |
Stencil Printing |
Dispensing |
| Paste Pkg. Options |
Jar 3-4 oz. 250-500 grams Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms. Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams DEK ProFlow 8 oz., Cassette 800 gms. |
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