800LF Lead Free No-Clean Solder Paste

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DSP800LF No-Clean Lead Free Solder Paste - SN100e Alloy
New lead free silver free no-clean solder paste developed to replace costly SAC alloys in solder paste for SMT assembly and for those switching from Sn/Pb to Pb free process. 800LF promotes excellent wetting and spreading. Unique flux vehicle provides fluxing activity levels that promote thermal stability and present thermal degradation when reflowing under air atmosphere (normal). Use of nitrogen is not required further reducing costs and increasing saving. DSP800LF is formulated with Sn100e alloy Sn/Cu/Co a less expensive lead free alloy option for those presently using SAC alloy compositions. DSP800LF exhibits superior joint strength, excellent wettability, print definition and tack life. Low hard non conductive residues are safe to remain on the board. Flux Classification is ROL1. Available in Jars, cartridges and for syringe dispensing.

Paste Packaging Options
Jar 3-4 oz. 250-500 grams
Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms.
Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams
DEK ProFlow 8 oz., Cassette 800 gms.