Qualiteks Delta Lead Free No-Clean Solder Paste
Formulated for finepitch printability, increased stencil life, high tack force and good wetting. Meet J-STD-004/005 requirements and complies with Bellcore specifications. Formulations suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls.
Qualiteks Delta Lead Free Water-Soluble Solder Paste Formulated to accommodate a broad range of SMT applications where water/aqueous post reflow cleaning is required. Qualiteks unique formulations produce reliable solder joints that are shiny and bright.
Qualiteks Delta Lead Free RMA Solder Paste
RMA lead free solder paste exhibit superior joint strength, excellent wettability and brick like print definition. Meets or exceeds J-STD-004/J-STD-005.