DSP862 No-Clean Lead Free Solder Paste
862 no clean lead free solder paste has been designed for a broad range of surface mount applications and has a wide processing window. Delivers comparable performance to Sn/Pb paste. Yields excellent print capability and will minimize transition concerns from Sn/Pb to lead free process. Complies with ROL0 IPC and IPC Class III voiding classification ensures long-term product reliability. Yields smooth, clear, non-conductive soft residues and shiny uniform joints after reflow.


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Paste Packaging Options
Jar 3-4 oz. 250-500 grams
Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms.
Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams
DEK ProFlow 8 oz., Cassette 800 gms.