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Recommended Lead Free Solder Alloy
TAL (Take Action Limits)

Take Action Limits, also known as ‘dump pot specifications,’ are very important to any electronics manufacturing company using flow soldering techniques either in selective soldering or wave soldering. Impurities in solder can cause the characteristics of the alloy to change and result in assembly defects that can cost thousands of dollars.

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Element
TAL*
Comments
  
Element
TAL
Comments
  
Preconditioning
Pot/Wave
SAC305
SN100E
Copper (Cu)
0.750
0.300
 Above 1.00% may cause bridging and sluggish solder flow.  
Tin (Sn)
BAL
BAL
 
Bismuth (Bi)
0.250
0.250
 If levels exceed 0.2% contamination source should be investigated.  
Lead (Pb)
0.10
0.10
 RoHS Directive 2002/95/EC Maximum.  
Zinc (Zn)
0.008
0.005
 May cause higher levels of bridging, icicling and surface oxidation.  
Copper (Cu)
0.30-1.00
0.30-1.00
Above 1.00% may cause bridging and sluggish solder flow.
  
Iron (Fe)
0.020
0.020
 Indicator of pot erosion and may cause joint gritty formation and the formation of FeSn2.  
Bismuth (Bi)
0.20
0.20
 If levels exceed 0.2% contamination source should be investigated.  
Silver (Ag)
0.750
0.100
 Solderability can be affected.  
Zinc (Zn)
 0.003 0.003
May cause higher levels of bridging, icicling and surface oxidation.
  
Antimony (Sb)
0.500
0.500
 Enhances thermal fatique and joint strength.   Iron (Fe) 0.02 0.02
Indicator of pot erosion and may cause joint gritty formation and the formation of FeSn2.
  
Nickel (Ni)
0.025
0.010
 Solder drossing, sluggish.  
Silver (Ag)
2.8-3.5
0.20
 Solderability can be affected.  
Cadmium
(Cd)
0.010
0.005
 RoHS Directive 2002/95/EC Maximum.   Antimony (Sb) 0.20 0.20 Lead free alloys can tolerate up to 1.0%.  
Aluminum (Al)
0.008
0.006
 May cause higher levels of bridging, icicling and surface oxidation.  
Nickel (Ni)
0.05
<0.01* 0.05
* Solder drossing, sluggish. Slow wetting speed and reduce hole fill.
 
Gold (Au)
0.500
0.200
 At levels above 0.1% joint strength may be compromised. Sluggish solder.  
Cadmium (Cd)
0.003
0.003
 RoHS Directive 2002/95/EC Maximum.  
Arsenic (As)
0.030
0.030
 Levels greater than 0.03% can cause de-wetting.  
Aluminum (Al)
 0.002
0.002
May cause higher levels of bridging, icicling and surface oxidation.
 
*Per J-STD-001  
Gold (Au)
0.10
0.10
 At levels above 0.1% joint strength may be compromised.  
   
Arsenic (As)
0.03
0.03
Levels greater than 0.03% can cause de-wetting.
  
   
Cobalt (Co)
N/A
<0.01
 Solderability can be affected and long term joint reliability at risk.  
   
Germanium (Ge)
N/A
<0.005*
 * Solder drossing, sluggish.  
    * Applies to a popular Sn/Cu/Ni/Ge alloy only.  
This data is based on information that the mfg. believed to be reliable and offered in good faith. Qualitek International, Inc. makes no warranties expressed or implied as to its accuracy and assumes no responsibilities and liabilities arising out of its use by others as conditions and methods of use of the products are beyond the control of Qualitek International, Inc. The user must determine the suitability of the product before using it on a commercial basis. The warranties extend only t the conformity of the product to the physical descriptions. In no event will Qualitek International, Inc. be responsible for special, incidental and consequential damages whether the claim is in contract, negligence r otherwise. Qualitek specifically disclaims an liability for consequential or incidental damages of any kind, including lost profits.