| NO-CLEAN Selective Soldering Flux Selection Guide |
| Type |
Features |
S.G.@25°C |
% Solids |
Acid No. |
J-STD-004B |
Thinner |
| 302 |
Halogen-Free flux with very low solids, may be used for LEADED and LEAD-FREE applications for a broader process window.
| 302 TDS | 302 SDS | |
0.800 |
2.3 |
20.0 |
ORL0 |
300A |
| 393 |
Halogen-Free, low solids flux, may be usede for LEADED & LEAD-FREE alloys. Good Solderability, non-tacky low residues for improved cosmetics.| 393 TDS | 393 SDS | |
0.811 |
2.9 |
23.5 |
ORL0 |
300A |
| 380 |
Rosin-based flux leads to higher activity. Recommended for LEADED wave applications.
| 380 TDS | 380 SDS | |
0.793 |
3.3 |
18.2 |
ROL0 |
300A |
| 381 |
Low solids flux compatible with both LEADED and LEAD-FREE systems that eliminates skips and shorts often experienced with wave assembly.
| 381 TDS | 381 SDS | |
0.800 |
3.7 |
20.5 |
ROL0 |
300A |
| 399-42 |
Halogen-Free, low solids flux, compatible with both LEADED & LEAD-FREE systems. Excellent wettability, non-conductive and tack-free residues.
| 399-42 TDS | 399-42 SDS | |
0.832 |
4.5 |
36.0 |
ORL0 |
300A |
| 305 |
Rosin-based, Halogen-Free flux designed for single and double sided plated through hole boards. Recommended for LEADED solder systems.
| 305 TDS | 305 SDS | |
0.795 |
5.0 |
25.0 |
ROL0 |
300A |
| 386 |
Rosin-containing flux provides excellent solderability for both general and high density boards. Use for LEADED and LEAD-FREE applications.
| 386 TDS | 386 SDS | |
0.810 |
5.5 |
27.0 |
ROL0 |
300A |
