News Releases
New! Improved Solder Check Up Program
Qualitek International, Inc. has expanded the Solder Check UP Program to now include analysis for the very popular Sn100C, SACX, K100LD and Sn100E in addition to the wide variety of pot alloys analysis already available.
A periodic solder analysis is necessary to maintain solder pot integrity and avoid contamination that may cause a variety of quality and solderability issues. A solder analysis is recommended every 30 days. The test will consist of a 1/2lbs sample sent to one of our worldwide locations. We will analyze the sample sent then e-mail customers the status of solder impurities as well as the level of tin that will aid in identifying any solder joints or processing problems. To best suit customer requirements, there are several solder check-up programs for leaded pots as well as lead free.
Customers have the option to purchase prepaid mailers at a discount or send solder samples through UPS or postal mail.
| Click here for full program details |
New! Product 862 No Clean Lead Free Solder Paste
862 is a new solder paste designed for a broad range of lead free surface mount applications. Qualitek's 862 broad processing window is designed to minimize transition concerns from Sn/Pb process. 862 yields excellent print capability performance across various board designs. Excellent hot slump resistance: Yields No or Low Solder Beading & Bridging. Qualitek has developed a unique flux system designed specifically for high temperature lead free alloy that produces shiny solder joints surrounded by non-conductive, smooth, clear and highly insulated post soldering residue.
862 complies with ROL0 IPC and IPC Class III voiding classifications ensures long-term product reliability. 862 No Clean Solder Paste is available in standard form as well as in GREEN color with SAC alloys and is compatible with most other lead free alloys.
LF GREEN Lead Free Solder Paste
LF GREEN is a patent pending lead free solder paste that is green in color and remains green during the entire soldering process until reflowed. Once reflowed, clear residues remain with normal metallic joint appearance. Under black light LF GREEN boards will fluoresce once again easily identifying the lead free boards. LF GREEN is available in the most common lead free alloy compositions of Sn/Ag/Cu and Sn/Ag and costs are the same as typical lead free solders because costs are based on the metals and not the green color of the paste. Formulations are available in No-Clean, Water-Soluble and RMA flux types. Available in type 3, 4 and 5 meshes. Packaged in DEK Proflow Cassettes, Jars and Cartridges.
Qualitek Delta Elite DSP 818 No-Clean Solder Paste
Low Residue No-Clean Solder Paste
Slight post soldering residues are transparent, non-corrosive and non-conductive. The unique properties of this formula include: excellent activity, long stencil life, tack time and shelf life. Excellent wetting on OSP. Bellcore compliant. Prints up to 8 in per second. Trace Lab report available.
Qualitek Delta 691 No Clean Solder Paste
Enhanced Printing & Soft Colorless Post Solder Residue
691 No-Clean Solder Paste incorporates a combination of improved hot slump resistant material along with a new activator blend, which eliminates Mid Chip Beading and Micro Solder Balling. High print speed up to 8 in/sec.,. Greater than >8 hours of stencil life. Suitable for pin in paste application. 691 is 100% ICT Pin Probable, and will reflow with or without nitrogen. Compatible with lead free process. Compatible with enclosed print head system, DEK Proflow, Rheo Pump and Cross Flow.
Qualitek 798 Water Soluble Solder Paste
Reduces Pillow Effect On 0203 Capacitors
798 is a halide free, slump resistant water soluble solder paste that reduces pillow effects on 0203 capacitors. 798 utilizes a low volatility solvent system, resulting in a tack time of over 12 hours. Easily remove post solder residues with warm DI water cleaning systems.
Qualitek Delta 788 WS Solder Paste
Print Bricks Every Time
788 water-soluble solder paste is highly slump resistant. This formulation has enhanced printing characteristics and is non-hygroscopic (moisture resistant) which will not degradate in dry and humid climates. Superior flux activity will eliminate voiding and solderability issues with fine pitch and Micro BGA components. Robust profile window ensures drop in to most water soluble processes. Also Available in -400+635 Mesh particle size for < 16 mil fine pitch printing. 100% water soluble and will wash easily with warm deionized water. Compatible with lead free processes. Available in Jars, syringes, cartridges and DEK Proflow tested and approved.
Qualitek's LF217 Lead Free Solder Paste
LF217 Lead Free Solder Paste alloy composition Sn95.5/Ag4.0/Cu0.5.
LF217 is designed as a lead free alternative for Sn/Pb alloys in electronics assembly operations. These series of pastes were specifically formulated to provide activity levels similar to Sn/Pb formulations. Although LF217 requires higher temperatures, these pastes do not exhibit thermal degradation. In the search for lead free alternatives, the electronics industry has selected an alloy consisting of Tin, Silver and Copper. Qualitek has developed flux systems in combination with these alloy system, which exhibits superior joint strength and excellent wettability. Qualitek has addressed the main challenge of lead free soldering by providing robust formulations with the least effect on current processes. LF217 is an available alloy for Delta Elite 691 No-Clean Solder Paste and 788 Water-Soluble Solder Paste.
Benefits:- Enhanced Printing- Excellent wetting on OSP- Extended stencil & tack time- Air or nitrogen reflow- Pin Probable formulations.
QUALITEK NC-601 No-Clean Wire Solder
Known for excellent activity and wetting. Leaves virtually no post soldering residue. Slight remaining residues are safe to leave on the boards but may as desired be removed with hot DI water. Available in all standard diameters and at 1.1% flux. Bellcore compliant.
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