Type

Process

Features

Packaging

SOLID CORE Sn42/Bi58

Lead Free
Low Temp.

Low temperature lead free solder wire alloy Sn42/Bi58 for heat sensitive assembly. Available in 0.032" and 0.048" diameters. Meets IPC-J-STD-006C specifications.

500 gram box

825HF SOLDER PASTE

No-Clean
Lead Free
Low Temp.

Robust No-Clean stencil printing solder paste designed for low temperature lead-free assembly. Exhibits brick like print definition halogen-free paste excellent wetting and coalescence. Room temperature stable formulation up to 6 months. Minimal post solder residues are non-conductive, non-corrosive and highly insulated.

250 gram jar

500 gram
jar

888D SOLDER PASTE

No-Clean
Lead Free Low Temp.

No-Clean dispensing paste designed for low temperature lead-free assembly. Exhibits excellent print definition and long tack life. Minimal post solder residues are non-conductive, non-corrosive and highly insulated.

35 gram 10cc syringe

100 gram
35 cc syringe

PF608
PASTE FLUX

No-Clean
Lead Free Low Temp.

Unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high & low temperature lead free alloys. PF608 paste flux provides the fluxing activity levels that promote fast wetting action and maximum wetting spread.

8 gram
10cc
syringe

100 gram
4 oz.
jar

FLUX PEN

No-Clean
Lead Free Low Temp.

Marker style rework wands are pen like reservoirs for applying flux. The mechanical nature permits a localized, controlled application of flux for ework or adding components. Formulated for low temp. applications, heat sensitive assembly.

1/3 oz. marker style reservoirs

1/3 oz. reservoirs
Box of 25

TIP TINNER
Sn42/Bi58

Lead Free Low Temp.

Unique mixture of solder powder and thermally stable, oxide-reducing compounds. Tip Tinner provides better cleaning and re-tinning of highly oxidized soldering iron tips than using a wet sponge or rosin-cored wire. Designed for cleaning and re-tinning of soldering iron tips for low temperature applications.

1oz.
can

1oz.
can
Box of 10