QUALITEK BGA2005 REWORK STATION
• Utilizes Micro-processor and infrared sensor technology to solder and desolder surface mount components safely and accurately. It combines the features of QUALITEK IR2005 Infrared Rework Station and QUALITEK PL2005 Precision Placement System.
• Soldering and desoldering processes are under the monitoring of non-contact infrared sensors to get the optimum and reproductive PCB temperature.
• Controlling reflow soldering by looped circuit ensures a precise temperature window, even heat distribution and suitable peak value of temperature.
• The adjustable aperture can protect the adjacent components (which is sensitive to the temperature) on the PCB from being heated. Nozzles are not required.
• A reflow process camera is utilized to view the melting situation of solder materials during the whole soldering and desoldering process.
• It can withstand PCB’s with a big thermal capacity and other high temperature situation such as lead free soldering.

QUALITEK PL2005 PRECISION PLACEMENT SYSTEM
• QUALITEK PL2005 PRECISION PLACEMENT SYSTEM
• PL2005 camera enables precise placement and accurate alignment by micro-adjustment and alignment.
| View All BGA Stations |