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Delta Solder Paste

Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly.  Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies.  Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges.  | Product Brochure | Solder Paste Technical Data & SDS |

NO-CLEAN

Type

Process

Features

J-STD-004B

RoHs Compliant

670I

No-Clean

Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues

REL0

No

XP692

No-Clean

Excellent wettability, extended tack time, yields soft, non-tacky residues

REL0

No

699

No-Clean

Halogen-Free paste with excellent wetting and coalescence for fine pitch

ROL0

No

825HF

No-Clean

Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence

ROL0

Yes

863

No-Clean

Halogen-Free technology, low voiding paste with excellent wettability

ROL0

Yes

866

No-Clean

Zero-halogen paste with light-colored, pin probable residues

ROL0

Yes

875

No-Clean

Halogen-Free formulation with superior low flux spatter

REL0

Yes

615D

No-Clean

Dispensing solder paste with hard non-conductive residues

REL0

No

618D

No-Clean

Specifically designed for Pb-Free applications, Easily dispensed for rework applications

ROL0

Yes

619D

No-Clean

Dispensing solder paste with transparent, pin testable post soldering residues

REL0

No


WATER-SOLUBLE

Type

Process

Features

J-STD-004B

RoHs Compliant

787LV

Water-Soluble

Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life

ORH0

Yes

788

Water-Soluble

Non-hygroscopic paste where residues are easily removed, long stencil life

ORL0

No

792

Water-Soluble

Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-Free alloys

ORM0

No/Yes

798

Water-Soluble

Excellent wetting on OSP surfaces, pin testable paste with low residues

ORL0

No

798LF

Water-Soluble

Water-Soluble paste with enhanced activity for a broad range of applications, Exhibits excellent printing characteristics with easy residue removal properties

ORH0

Yes

XP799

Water-Soluble

Designed for superior wetting on OSP surfaces with extended stencil life

ORL1

No

717D

Water-Soluble

Halide-free dispensing paste with easy removal of residues

ORL0

No

718D

Water-Soluble

Dispensing solder paste designed specifically for Pb-Free applications

ORH0

Yes

 

ROSIN-BASED

Type

Process

Features

J-STD-004B

RoHs Compliant

230

RMA

RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications

ROM0

No/Yes

215D

RMA

Dispensing RMA solder paste with hard, non-conductive residues

ROM0

No/Yes

350

RA

Robust Sn/Pb formulation for Sn/Pb and lead-free applications

ROM1

No/Yes

315D

RA

Dispensing solder paste with excellent wettability

ROM0

No/Yes

 

HALOGEN-FREE

Type

Process

Features

J-STD-004B

RoHs Compliant

699

No-Clean

Halogen-Free paste with excellent wetting and coalescence for fine pitch

ROL0

No

825HF

No-Clean

Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence

ROL0

Yes

863

No-Clean

Halogen-Free technology, low voiding paste with excellent wettability

ROL0

Yes

866

No-Clean

Zero-halogen paste with light-colored, pin probable residues

ROL0

Yes

875

No-Clean

Halogen-Free formulation with superior low flux spatter

REL0

Yes

 

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