Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly. Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies. Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges. | Product Brochure | Solder Paste Technical Data & SDS |
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NO-CLEAN
Type |
Process |
Features |
J-STD-004B |
RoHs Compliant |
670I |
No-Clean |
Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues |
REL0 |
No |
XP692 |
No-Clean |
Excellent wettability, extended tack time, yields soft, non-tacky residues |
REL0 |
No |
699 |
No-Clean |
Halogen-Free paste with excellent wetting and coalescence for fine pitch |
ROL0 |
No |
825HF |
No-Clean |
Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence |
ROL0 |
Yes |
863 |
No-Clean |
Halogen-Free technology, low voiding paste with excellent wettability |
ROL0 |
Yes |
866 |
No-Clean |
Zero-halogen paste with light-colored, pin probable residues |
ROL0 |
Yes |
875 |
No-Clean |
Halogen-Free formulation with superior low flux spatter |
REL0 |
Yes |
615D |
No-Clean |
Dispensing solder paste with hard non-conductive residues |
REL0 |
No |
618D |
No-Clean |
Specifically designed for Pb-Free applications, Easily dispensed for rework applications |
ROL0 |
Yes |
619D |
No-Clean |
Dispensing solder paste with transparent, pin testable post soldering residues |
REL0 |
No |
WATER-SOLUBLE
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787LV |
Water-Soluble |
Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life |
ORH0 |
Yes |
788 |
Water-Soluble |
Non-hygroscopic paste where residues are easily removed, long stencil life |
ORL0 |
No |
792 |
Water-Soluble |
Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-Free alloys |
ORM0 |
No/Yes |
798 |
Water-Soluble |
Excellent wetting on OSP surfaces, pin testable paste with low residues |
ORL0 |
No |
798LF |
Water-Soluble |
Water-Soluble paste with enhanced activity for a broad range of applications, Exhibits excellent printing characteristics with easy residue removal properties |
ORH0 |
Yes |
XP799 |
Water-Soluble |
Designed for superior wetting on OSP surfaces with extended stencil life |
ORL1 |
No |
717D |
Water-Soluble |
Halide-free dispensing paste with easy removal of residues |
ORL0 |
No |
718D |
Water-Soluble |
Dispensing solder paste designed specifically for Pb-Free applications |
ORH0 |
Yes |
ROSIN-BASED
Type |
Process |
Features |
J-STD-004B |
RoHs Compliant |
230 |
RMA |
RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications |
ROM0 |
No/Yes |
215D |
RMA |
Dispensing RMA solder paste with hard, non-conductive residues |
ROM0 |
No/Yes |
350 |
RA |
Robust Sn/Pb formulation for Sn/Pb and lead-free applications |
ROM1 |
No/Yes |
315D |
RA |
Dispensing solder paste with excellent wettability |
ROM0 |
No/Yes |
HALOGEN-FREE
Type |
Process |
Features |
J-STD-004B |
RoHs Compliant |
699 |
No-Clean |
Halogen-Free paste with excellent wetting and coalescence for fine pitch |
ROL0 |
No |
825HF |
No-Clean |
Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence |
ROL0 |
Yes |
863 |
No-Clean |
Halogen-Free technology, low voiding paste with excellent wettability |
ROL0 |
Yes |
866 |
No-Clean |
Zero-halogen paste with light-colored, pin probable residues |
ROL0 |
Yes |
875 |
No-Clean |
Halogen-Free formulation with superior low flux spatter |
REL0 |
Yes |
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