Q-Pearls Lead Free & Leaded BGA Solder Spheres

BGA Solder Spheres For Lead Free & Leaded Assembly

Qualitek Asia manufactures Q-Pearls utilizing the latest technology that assures exact alloy composition, consistent accurate diameters and highly spherical shapes. All spheres are made from pure metals combined to provide required alloy composition according to J-STD-006 specification or customer specific. After forming the spheres are classified for size by a precise and non-abrasive sorting process. The diameters of the spheres are monitored and controlled within 0.001″ +/- 0.0005″ tolerance. Sphere size distribution is measured precisely by a sophisticated image analysis system connected to scanning Electron Microscope (SEM). To determine sphericity, sphere diameter is measured in 16 directions in a fraction of a second.

Sphere Size & Composition
Choosing the correct alloy and sphere size is based on the type of BGA package and the processing temperature of your assembly. Solder Spheres in Ball Grid Array packages are used to provide the electrical and mechanical connection between the component and the board assembly. Available in 50K vial. BGA Spheres may be purchased through your local distributor. Contact factory near you direct.| Product Brochure | BGA Sphere Technical Data & SDS |

 

Type

Process

Features

IPC-J-STD-006C

RoHs Compliant

670Sn63/Pb37
Sn62/Pb36/Ag2
Sn10/Pb88/Ag2
Sn10/Pb90

Ball Grid Array

Q-Pearl solder spheres are spefifically designed for Ball Grid Array (BGA) components. Q-Pearl Spheres are manufactured from pure metals that meet IPC-J-STD-006 requirements.

Meets or exceeds industry requirements

No

LF965-30
(SAC305) Sn96.5/Ag3.5

Ball Grid Array

Q-Pearl solder spheres designed for Ball Grid Array components that are RoHs compliant. Lead-free solde spheres meet IPC-J-STD-006C requirements.

Meets or exceeds industry requirements

Yes

 

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Q-Pearls Lead Free & Leaded BGA Solder Spheres

BGA Solder Spheres For Lead Free & Leaded Assembly

Qualitek Asia manufactures Q-Pearls utilizing the latest technology that assures exact alloy composition, consistent accurate diameters and highly spherical shapes. All spheres are made from pure metals combined to provide required alloy composition according to J-STD-006 specification or customer specific. After forming the spheres are classified for size by a precise and non-abrasive sorting process. The diameters of the spheres are monitored and controlled within 0.001″ +/- 0.0005″ tolerance. Sphere size distribution is measured precisely by a sophisticated image analysis system connected to scanning Electron Microscope (SEM). To determine sphericity, sphere diameter is measured in 16 directions in a fraction of a second.

Sphere Size & Composition
Choosing the correct alloy and sphere size is based on the type of BGA package and the processing temperature of your assembly. Solder Spheres in Ball Grid Array packages are used to provide the electrical and mechanical connection between the component and the board assembly. Available in 50K vial. BGA Spheres may be purchased through your local distributor. Contact factory near you direct.| Product Brochure | BGA Sphere Technical Data & SDS |

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