BGA Rework Tacky Paste Flux

Paste Flux Tacky Flux

Qualitek paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering, BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Paste Flux formulations are available for lead and lead free assembly in No-Clean, RMA, RA, and Water-Soluble formulations.  | Paste Flux Tacky Flux Technical Data & SDS |

Standard Packaging: Paste Fluxes are packaged in: 8 gram 10 cc Syringes 24 gram 30 cc Syringes 50 gram Jars 100 gram Jars

NO-CLEAN

Type

Process

Features

J-STD-004B

RoHs Compliant

PF600

No-Clean

No-Clean paste flux designed for rework of surface mount assemblies. May be dispensed or brushed on. Residues are non-corrosive and non-conductive. Halide <0.05 based on quantative halide test.
| PF600 TDS | PF600 SDS |

REL0

Yes

PF601

No-Clean

No-Clean paste flux designed for touch up and rework applications. PF601 paste flux is light in color with non-conductive residues. Halide <0.05 based on quantative halide test.
| PF601 TDS | PF601 SDS |

REL0

Yes

PF608

No-Clean

No-Clean paste flux designed for lead-free repair work. Best seller. Halide <0.05 based on quantative halide test.
| PF608 TDS | PF608 SDS |

REL0

Yes


WATER-SOLUBLE

Type

Process

Features

J-STD-004B

RoHs Compliant

PF700

Water-Soluble

Dark Amber Water-Soluble paste flux designed for rework of surface mount assemblies. Halide 0 (Zero) based on theorotical value.
| PF700 TDS | PF700 SDS |

ORM0

Yes

 

ROSIN-BASED

Type

Process

Features

J-STD-004B

RoHs Compliant

PF200

RMA

Rosin Mildly Activated paste flux made of high grade syntheti resins and rosins, Non-corrosive residues. Halide<0.05 based on quantative halide test.
| PF200 TDS | PF200 SDS |

RELO

Yes

PF400

RA

Rosin Activated paste flux. Best seller. Halide <0.05 based on quantative halide test.
| PF400 TDS | PF400 SDS |

ROL0

Yes

 

 

BGA Rework Tacky Paste Flux

Paste Flux Tacky Flux

Qualitek paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering, BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Paste Flux formulations are available for lead and lead free assembly in No-Clean, RMA, RA, and Water-Soluble formulations.  | Paste Flux Tacky Flux Technical Data & SDS |

Standard Packaging: Paste Fluxes are packaged in: 8 gram 10 cc Syringes 24 gram 30 cc Syringes 50 gram Jars 100 gram Jars

NO-CLEAN

Type

Process

Features

J-STD-004B

RoHs Compliant

PF600

No-Clean

No-Clean paste flux designed for rework of surface mount assemblies. May be dispensed or brushed on. Residues are non-corrosive and non-conductive.
| PF600 TDS | PF600 SDS |

REL0

Yes

PF601

No-Clean

No-Clean paste flux designed for touch up and rework applications. PF601 paste flux is light in color with non-conductive residues.
| PF601 TDS | PF601 SDS |

REL0

Yes

PF608

No-Clean

No-Clean paste flux designed for lead-free repair work. Best seller.
| PF608 TDS | PF608 SDS |

REL0

Yes


WATER-SOLUBLE

Type

Process

Features

J-STD-004B

RoHs Compliant

PF700

Water-Soluble

Dark Amber Water-Soluble paste flux designed for rework of surface mount assemblies.
| PF700 TDS | PF700 SDS |

ORM0

Yes

PF708

Water-Soluble

Water-Soluble paste flux recommended for lead-free rework applications.
| PF708 TDS | PF708 SDS |

ORH0

Yes

ROSIN-BASED

Type

Process

Features

J-STD-004B

RoHs Compliant

PF200

RMA

Rosin Mildly Activated paste flux made of high grade syntheti resins and rosins, Non-corrosive residues.
| PF200 TDS | PF200 SDS |

REL0

Yes

PF400

RA

Rosin Activated paste flux. Best seller.
| PF400 TDS | PF400 SDS |

ROL0

Yes

 

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