Low Temp. Lead Free Soldering 2017-06-30T10:18:48+00:00

Low Temp. Lead Free Soldering Kits – Developed For Heat Sensitive Assembly


Qualitek’s low temp. lead free soldering kits are a recommended lead free soldering alternative for heat sensitive assembly that requires a low melting point. The low melting point prevents thermal degradation of the heat sensitive components. Alloys exceed J-STD-006 requirements and all other international standards. Qualitek manufactures soldering materials in the U.S.A. and abroad. Kit items are also sold separately. Full kits may be purchased at the solderstoreonline.com or though your Qualitek Local Distributor

 

LOW TEMPERATURE LEAD FREE SOLDERING KITS FOR HEAT SENSITIVE ASSEMBLY

Type

Process

Features

Packaging

SOLID CORE Sn42/Bi58

Lead Free
Low Temp.

Low temperature lead free solder wire alloy Sn42/Bi58 for heat sensitive assembly. Available in 0.032" and 0.048" diameters. Meets IPC-J-STD-006C specifications.
| Sn42/Bi58 TDS | Sn42/Bi58 SDS |

500 gram box

 

863 SOLDER PASTE

No-Clean
Lead Free
Low Temp.

Unique flux system that may be used with low melting temperature alloy, Sn42/Bi58. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere. Exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of DSP 863 are non-conductive and non-corrosive.
| 863 TDS | SDS |

250 gram jar

500 gram
jar

888D SOLDER PASTE

No-Clean
Lead Free Low Temp.

No-Clean dispensing paste designed for low temperature lead-free assembly. Exhibits excellent print definition and long tack life. Minimal post solder residues are non-conductive, non-corrosive and highly insulated.
| 888D TDS | SDS |

35 gram 10cc syringe

100 gram
35 cc syringe

PF608
PASTE FLUX

No-Clean
Lead Free Low Temp.

Unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high & low temperature lead free alloys. PF608 paste flux provides the fluxing activity levels that promote fast wetting action and maximum wetting spread.
| PF 608 TDS | SDS |

8 gram
10cc
syringe

100 gram
4 oz.
jar

FLUX PEN

No-Clean
Lead Free Low Temp.

Marker style rework wands are pen like reservoirs for applying flux. The mechanical nature permits a localized, controlled application of flux for ework or adding components. Formulated for low temp. applications, heat sensitive assembly.
| Flux Pen TDS | SDS |

1/3 oz. marker style reservoirs

1/3 oz. reservoirs
Box of 25

TIP TINNER
Sn42/Bi58

Lead Free Low Temp.

Unique mixture of solder powder and thermally stable, oxide-reducing compounds. Tip Tinner provides better cleaning and re-tinning of highly oxidized soldering iron tips than using a wet sponge or rosin-cored wire. Designed for cleaning and re-tinning of soldering iron tips for low temperature applications.
| Tip Tinner TDS | SDS |

1oz.
can

1oz.
can
Box of 10

 
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 Type  Process  Features Packaging
SOLID CORE Sn42/Bi58 Lead Free Low Temp. Low temperature lead free solder wire alloy Sn42/Bi58 for heat sensitive assembly. Available in 0.032" and 0.048" diameters. Meets IPC-J-STD-006C specifications. | Sn42/Bi58 TDS | Sn42/Bi58 SDS |  500 gram box  
 863 SOLDER PASTE  No-Clean Lead Free Low Temp.  Unique flux system that may be used with low melting temperature alloy, Sn42/Bi58. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere. Exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of DSP 863 are non-conductive and non-corrosive. | 863 TDS | SDS |  250 gram jar  500 gram jar
 888D SOLDER PASTE  No-Clean Lead Free Low Temp. No-Clean dispensing paste designed for low temperature lead-free assembly. Exhibits excellent print definition and long tack life. Minimal post solder residues are non-conductive, non-corrosive and highly insulated. | 888D TDS | SDS | 35 gram 10cc syringe  100 gram 35cc syringe
 PF608 PASTE FLUX  No-Clean Lead Free Low Temp.  Unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high & low temperature lead free alloys. PF608 paste flux provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. | PF 608 TDS | SDS |  8 gram 10cc syringe  100 gram 4 oz. jar
 FLUX PEN  No-Clean Lead Free Low Temp.  Marker style rework wands are pen like reservoirs for applying flux. The mechanical nature permits a localized, controlled application of flux for ework or adding components. Formulated for low temp. applications, heat sensitive assembly. | Flux Pen TDS | SDS |  1/3 oz. marker style reservoirs  1/3 oz. reservoirs Box of 25
 TIP TINNERSn42/Bi58  Lead Free Low Temp.  Unique mixture of solder powder and thermally stable, oxide-reducing compounds. Tip Tinner provides better cleaning and re-tinning of highly oxidized soldering iron tips than using a wet sponge or rosin-cored wire. Designed for cleaning and re-tinning of soldering iron tips for low temperature applications. | Tip Tinner TDS | SDS |  1oz. can  1oz. can Box of 10
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