ALCOHOL-BASED – NO-CLEAN
Flux |
Features |
S.G.@25°C |
% Solids |
Acid No. |
J-STD-004B |
Thinner |
302 |
No-Clean, Halogen-Free flux with very low solids, may be used for LEADED and LEAD-FREE applications for a broader process window.
| 302 TDS | 302 SDS |
|
0.800 |
2.3 |
20 |
ORL0 |
300A |
302+ |
No-Clean, Halogen-Free flux with low solids. Slightly higher solids lead to increased activity. May be used with LEADED and LEAD-FREE applications.
| 302+ TDS | 302+ SDS | |
0.804 |
3.0 |
29 |
ORL0 |
300A |
305 |
No-Clean, Rosin-based, Halogen-Free flux designed for single and double sided plated through hole boards. Recommended for leaded solder systems.
| 305 TDS | 305 SDS | |
0.795 |
5.0 |
25 |
ROL0 |
300A |
351 |
No-Clean, Halogen-Free, non-rosin flux with low solids. Leaves minimal residue. Recommended for use with LEADED systems.
| 351 TDS | 351 SDS | |
0.805 |
2.2 |
15 |
ORL0 |
300A |
360 |
No-Clean, Zero halogen, Heat stable flux with a unique solvent system. May be used LEADED and LEAD-FREE systems.
| 360 TDS | 360 SDS | |
0.813 |
2.5 |
16 |
ORL0 |
300B |
355-35 |
No-Clean, Halide-Free flux, designed for LEAD-FREE solder systems. Exhibits high activity.
| 355-35 TDS | 355-35 SDS | |
1.02 |
7.5 |
40 |
ORL0 |
300A |
380 |
No-Clean, Rosin-based flux leads to higher activity. Recommended for LEADED wave applications.
| 380 TDS | 380 SDS | |
0.793 |
3.3 |
18.2 |
ROL0 |
300A |
381 |
No-Clean, Low solids flux compatible with both LEADED and LEAD-FREE systems that eliminates skips and shorts often experienced with wave assembly.
| 381 TDS | 381 SDS | |
0.800 |
3.7 |
23 |
ROL0 |
300A |
391S |
No-Clean Halogen-Free flux in which virtually no residue remains on the assembly after soldering. Use with LEADED systems.
| 391S TDS | 391S SDS | |
0.798 |
2.0 |
18 |
ORL0 |
300A |
392-35 |
No-Clean, Halogen-Free, low solids organic flux with no surface insulation resistance degradation. Produces bright, lustrous solder joints. Designed for LEAD-FREE applications.
| 392-35 TDS | 392-35 SDS | |
0.811 |
4.0 |
45 |
ORL0 |
300A |
ALCOHOL-BASED – WATER-SOLUBLE
Flux |
Features |
S.G.@25°C |
% Solids |
pH |
% Halides |
J-STD-004B |
Thinner |
713N |
Water-Soluble, highly active organic flux designed for complete water solubility of post-soldering residues. Designed for LEADED systems.
| 713N TDS | 713N SDS | |
0.888 |
4.5 |
3.75 |
1.9 |
ORH1 |
700T |
714N |
Water-Soluble, non-spattering formulation designed for high speed soldering operations. Designed for LEADED systems.
| 714N TDS | 714N SDS | |
0.842 |
4.4 |
8.0 |
1.9 |
ORH1 |
700T |
735-11 |
Water-Soluble flux designed for automated soldering operations where rosin fluxes are not sufficiently active and inorganic fluxes are too corrosive. Designed for LEADED wave systems.
| 735-11 TDS | 735-11 SDS | |
0.950 |
16 |
2.0 |
3.0 |
ORH1 |
700T |
737N |
Water-Soluble, very active, robust flux with neutral pH that can be used with LEADED or LEAD-FREE solder systems. Best Seller
| 737N TDS | 737N SDS | |
0.846 |
17.5 |
7.3 |
2.2 |
ORH1 |
700T |
775 |
Water-Soluble flux designed specifically for high speed LEADED wave soldering applications and water cleaning systems.
| 775 TDS | 775 SDS | |
0.873 |
4.5 |
3.2 |
1.9 |
ORM1 |
700T |
VOC-FREE FLUXES (NON-FLAMMABLE FOR BOTH LEADED AND LEAD-FREE SYSTEMS)
Flux |
Features |
S.G.@25°C |
% Solids |
Acid No. |
pH |
% Halides |
J-STD-004B |
350NVOC |
No-Clean, VOC-Free, water-based, flux designed for mass soldering, Foaming version available.
| 350NVOC TDS | 350NVOC SDS | |
1.01 |
4.3 |
20 |
-- |
-- |
ORL0 |
355NVOC |
No-Clean, VOC-Free flux is a pin testable formula that remains active after chip wave eliminating solder ball formation.
| 355NVOC TDS | 355NVOC SDS | |
1.02 |
5.3 |
34 |
-- |
-- |
ORL0 |
357NVOC |
No-Clean, VOC-Free flux with lowest amount of solids leaving virtually no residue.
| 357NVOC TDS | 357NVOC SDS | |
1.01 |
1.5 |
22 |
-- |
-- |
ORL0 |
358NVOC |
No-Clean, VOC-Free, high reliability flux contains higher solids that increase flux activity.
| 358NVOC TDS | 358NVOC SDS | |
1.02 |
8.0 |
55 |
|
|
ORL0 |
735VF |
Water-Soluble, VOC-Free flux that contains a unique activator that promotes wetting on a variety of metallic substrates, Foaming version available.
| 735VF TDS | 735VF SDS | |
1.05 |
16.5 |
-- |
2.1 |
3.0 |
ORH1 |
737NVF |
Water Soluble, VOC-Free version of 737N flux so has a neutral pH and formulated to be effective over a broad preheat range.
| 737NVF TDS | 737NVF SDS |
|
1.02 |
12 |
-- |
7.2 |
2.2 |
ORH1 |
ROSIN FLUXES (DESIGNED FOR LEADED APPLICATIONS)
Flux |
Features |
S.G.@25°C |
% Solids |
J-STD-004B |
Thinner |
125 |
Non-activated flux containing 25% pure white gum rosin.
| 125 TDS | 125 SDS | |
0.844 |
25 |
ROL0 |
100T |
285 |
Rosin Mildly Activated flux with activities close to that of a fully activated rosin flux.
| 285 TDS | 285 SDS | |
0.875 |
36 |
ROL1 |
200T |
285-25 |
Rosin Mildly Activated flux with only 25% solids.
| 285-25 TDS | 285-25 SDS | |
0.842 |
25 |
ROL1 |
200T |
515 |
Rosin Activated flux with excellent foaming characteristics.
| 515 TDS | 515 SDS | |
0.823 |
19.5 |
ROM1 |
500T |
525MIL |
Rosin Activated flux designed for wave applications where cleanliness exceeds military specification requirements.
| 525MIL TDS | 525MIL SDS | |
0.837 |
25 |
ROM1 |
500T |
535MIL |
Rosin Activated flux ideal for wave soldering containing 35% solids.
| 535MIL TDS | 535MIL SDS | |
0.856 |
35 |
ROM1 |
500T |
545 |
Best-selling Rosin Activated flux with superior fluxing and foaming properties.
| 545 TDS | 545 SDS | |
0.923 |
50 |
ROM1 |
500T |
LEAD-TINNING FLUXES
Flux |
Features |
S.G.@25°C |
% Solids |
pH |
J-STD-004B |
Thinner |
813 |
Halogen-Free flux best for foaming applications.
| 813 TDS | 813 SDS | |
0.870 |
16 |
2.8 |
ORM0 |
800T |
814 |
Halogen-Free flux excellent for lead tinning applications.
| 814 TDS | 814 SDS | |
0.942 |
23 |
3.0 |
ORM0 |
800T |
820 |
Halogen-Free, organic flux with higher solids to increase activity.
| 820 TDS | 820 SDS | |
0.865 |
27 |
8.3 |
ORM0 |
800T |
830VHF |
VOC-Free, Halogen-Free flux with excellent residue cleanability.
| 830VHF TDS | 830VHF SDS | |
1.05 |
17 |
2.75 |
ORM0 |
-- |
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